Methods and apparatus for a semiconductor device package with improved thermal performance
US7892882B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2006 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Oct 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package assembly 200 includes a semiconductor die (e.g., an RF power amplifier) 208 fixed within the cavity of a conductive leadframe 204 using a thermally and electrically-conductive adhesive material 209. The semiconductor die 209 has a first side and a second side, wherein the first side includes at least one active area, and the second side includes at least one contact region. The conductive leadframe (e.g., a copper leadframe) 204 has two planar surfaces and a cavity formed therein. The adhesive material 209 is configured to couple the semiconductor die 208 within the cavity of the conductive leadframe 204 such that the first side of the semiconductor die is substantially coplanar with the first surface of the conductive leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.