Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer

US7893703B2 · kind B2 · utility

Assignee

• KLA-Tencor Technologies Corp. · US

Inventors

• Jeffrey Rzepiela · Sunnyvale, US
• Yiping Feng · New Brunswick, US
• Shiyou Pei · Naperville, US
• Alexander Kagan · Guilderland, US
• Jianou Shi · State College, US
• Sergio Edelstein · Los Gatos, US

Key dates

• Filing date: Aug 21, 2006
• Grant date: Feb 22, 2011
• Expiry date: Sep 12, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.