Patent · US Active

Wafer center finding

US7894657B2 · kind B2 · utility

12Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 15, 2008
Grant dateFeb 22, 2011
Priority date—
Expiry dateAug 21, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S414/136
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.