Electroless layer plating process and apparatus
US7897198B1 · kind B1 · utility
14Cited by
21References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2002 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Aug 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76873
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to a work piece by spin coating to produce a very thin conductive layer (in the range of a few hundred angstroms). The components are typically a reducing agent and a metal source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.