Exposed pad backside pressure sensor package
US7900521B2 · kind B2 · utility
21Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2009 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Apr 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.