Package-on-package system with internal stacking module interposer
US7901987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2008 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Dec 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package-on-package system includes: forming a first integrated circuit package including second top electrical contacts and first external electrical contacts on opposite sides thereof; forming an internal stacking module interposer including first top electrical contacts and base electrical connectors on opposite sides thereof; attaching the internal stacking module interposer to the first integrated circuit package with the first top electrical contacts connected to the second top electrical contacts; and molding a package encapsulant over the first integrated circuit package and around the internal stacking module interposer leaving a package encapsulant cavity for attaching a stacked package to the base electrical connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.