Dongjin Jung
14Patents
4h-index
19Co-inventors
53Inventor score
Filing activity: Dec 28, 2007 → Jul 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7989950B2 | Integrated circuit packaging system having a cavity | Electricity | 22 | Active |
| US8035210B2 | Integrated circuit package system with interposer | Electricity | 21 | Active |
| US7901987B2 | Package-on-package system with internal stacking module interposer | Electricity | 12 | Active |
| US8704365B2 | Integrated circuit packaging system having a cavity | Electricity | 10 | Active |
| US9865453B2 | Semiconductor devices including device isolation structures and methods of manufacturing the same | Electricity | 1 | Active |
| US7863100B2 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Electricity | 1 | Active |
| US12388166B2 | Antenna module and electronic device comprising same | Electricity | 0 | Active |
| US12081181B2 | Variable-gain amplifiers with configurable baluns | Electricity | 0 | Active |
| US12418112B2 | Antenna structure and electronic device including same | Electricity | 0 | Active |
| US11652453B2 | Tunable baluns for multimode power amplification | Electricity | 0 | Active |
| US11558545B2 | Electronic apparatus, controlling method of electronic apparatus, and computer readable medium | Physics | 0 | Active |
| US11211911B2 | Capacitive-coupled bandpass filter | Electricity | 0 | Active |
| US12142021B2 | Electronic apparatus, controlling method of electronic apparatus, and computer readable medium | Physics | 0 | Active |
| US9825142B2 | Methods of fabricating semiconductor devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.