Integrated circuit package system for electromagnetic isolation
US7902644B2 · kind B2 · utility
95Cited by
27References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2007 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Mar 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.