Inventor · Singapore, SG

Rui Huang

90Patents
15h-index
48Co-inventors
80Inventor score

Filing activity: May 30, 2006 → Apr 24, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US7902644B2 Integrated circuit package system for electromagnetic isolation Electricity 95 Active
US8354304B2 Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant Electricity 63 Active
US7772046B2 Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference Electricity 58 Active
US7799602B2 Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure Electricity 52 Active
US7618846B1 Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device Electricity 50 Active
US9385009B2 Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP Electricity 46 Active
US9524955B2 Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure Electricity 44 Active
US8390108B2 Integrated circuit packaging system with stacking interconnect and method of manufacture thereof Electricity 44 Active
US8072059B2 Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die Electricity 39 Active
US7989270B2 Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors Electricity 39 Active
US9252172B2 Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region Electricity 31 Active
US8101460B2 Semiconductor device and method of shielding semiconductor die from inter-device interference Electricity 31 Active
US7666709B1 Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns Electricity 30 Active
US8354746B2 Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant Electricity 28 Active
US7880275B2 Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device Electricity 27 Active
US7993941B2 Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant Electricity 15 Active
US7701040B2 Semiconductor package and method of reducing electromagnetic interference between devices Electricity 15 Active
US8624364B2 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof Electricity 15 Active
US8178956B2 Integrated circuit package system for shielding electromagnetic interference Electricity 15 Active
US8507319B2 Integrated circuit package system with shield Electricity 13 Active
US8304880B2 Integrated circuit packaging system with package-on-package and method of manufacture thereof Electricity 13 Active
US7989269B2 Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof Electricity 12 Active
US8138024B2 Package system for shielding semiconductor dies from electromagnetic interference Electricity 11 Active
US8476120B2 Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors Electricity 11 Active
US8399305B2 Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist Electricity 10 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.