Bipolar device and fabrication method thereof
US7906796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2008 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Jun 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/133
Abstract
In a bipolar device, such as transistor or a thyristor, the emitter layer or the anode layer is formed of two high-doped and low-doped layers, a semiconductor region for suppressing recombination comprising an identical semiconductor having an impurity density identical with that of the low-doped layer is present being in contact with a base layer or a gate layer and a surface passivation layer, and the width of the semiconductor region for suppressing recombination is defined equal with or longer than the diffusion length of the carrier. This provides, among other things, an effect of attaining reduction in the size of the bipolar transistor or improvement of the switching frequency of the thyristor without deteriorating the performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.