Inventor · Tokyo, JP

Natsuki Yokoyama

61Patents
17h-index
75Co-inventors
87Inventor score

Filing activity: Nov 24, 1987 → Jun 20, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US4897709A Titanium nitride film in contact hole with large aspect ratio Electricity 114 Expired
US7402449B2 Integrated micro electro-mechanical system and manufacturing method thereof Performing Operations; Transporting 101 Expired
US5820679A Fabrication system and method having inter-apparatus transporter Emerging Cross-Sectional Technologies 93 Expired
US5981399A Method and apparatus for fabricating semiconductor devices Electricity 67 Expired
US5270259A Method for fabricating an insulating film from a silicone resin using O.sub . Electricity 52 Expired
US6099598A Fabrication system and fabrication method Emerging Cross-Sectional Technologies 51 Expired
US5562800A Wafer transport method Emerging Cross-Sectional Technologies 50 Expired
US5858863A Fabrication system and method having inter-apparatus transporter Emerging Cross-Sectional Technologies 40 Expired
US7045843B2 Semiconductor device using MEMS switch Electricity 40 Expired
US5177589A Refractory metal thin film having a particular step coverage factor and ratio of surface roughness Electricity 38 Expired
US4792842A Semiconductor device with wiring layer using bias sputtering Electricity 33 Expired
US5175017A Method of forming metal or metal silicide film Electricity 32 Expired
US6461957B1 Method of manufacturing semiconductor device Electricity 31 Expired
US7115943B2 Nonvolatile semiconductor memory device and manufacturing method thereof Electricity 29 Expired
US6677230B2 Method of manufacturing semiconductor device Electricity 29 Expired
US5270232A Process for fabricating field effect transistor Emerging Cross-Sectional Technologies 23 Expired
US5601686A Wafer transport method Emerging Cross-Sectional Technologies 17 Expired
US7062344B2 Fabrication system and fabrication method Emerging Cross-Sectional Technologies 16 Expired
US7325457B2 Sensor and sensor module Physics 14 Active
US6103566A Method for manufacturing semiconductor integrated circuit device having a titanium electrode Electricity 14 Expired
US6710383B2 MISFET semiconductor device having a high dielectric constant insulating film with tapered end portions Electricity 8 Expired
US7451656B2 Semiconductor device embedded with pressure sensor and manufacturing method thereof Electricity 8 Active
US7199022B2 Manufacturing method of semiconductor device Emerging Cross-Sectional Technologies 8 Expired
US7270012B2 Semiconductor device embedded with pressure sensor and manufacturing method thereof Electricity 7 Expired
US6204184A Method of manufacturing semiconductor devices Electricity 6 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.