Patent · US Active

Semiconductor wafer with rear side identification and method

US7911036B2 · kind B2 · utility

3Cited by

8References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stephan Bradl · Regensburg, DE
Rainer Holmer · Steinach, DE

Key dates

Filing date	Jan 11, 2007
Grant date	Mar 22, 2011
Priority date	—
Expiry date	Nov 14, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.