Integrated circuit package system with leadframe array
US7915716B2 · kind B2 · utility
60Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Apr 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.