Patent · US Active

Tracking thermal mini-cycle stress

US7917328B2 · kind B2 · utility

6Cited by

9References

20Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Jon A. Casey · Poughkeepsie, US
Michael Stephen Floyd · Cedar Park, US
Soraya Ghiasi · Austin, US
Kenneth C. Marston · Poughquag, US
Jennifer V. Muncy · Ridgefield, US
Malcom S. Ware · Austin, US
Roger D. Weekly · Austin, US

Key dates

Filing date	Aug 20, 2008
Grant date	Mar 29, 2011
Priority date	—
Expiry date	Feb 16, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG06F11/3058
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.