Patent · US Active

Micromechanical sensor element

US7918136B2 · kind B2 · utility

8Cited by

9References

31Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Joerg Muchow · Reutlingen, DE
Hubert Benzel · Neckartenzlingen, DE
Simon Armbruster · Wannweil, DE
Christoph Schelling · Stuttgart, DE

Key dates

Filing date	Nov 21, 2006
Grant date	Apr 5, 2011
Priority date	—
Expiry date	Mar 28, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG01L9/0055
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical sensor element (1) is provided, which has a sealed diaphragm (2) affixed in a frame (3), exhibits high sensitivity at high overload resistance and has a small size, and which allows a piezoresistive measured-value acquisition. To this end, at least one carrier element (4), which is connected to the frame (3) via at least one connection link (5), is formed in the region of the diaphragm (2). Furthermore, piezoresistors (6) for detecting a deformation are situated in the region of the connection link (5).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.