Patent · US Active

Micromechanical component and manufacturing method

US7919346B2 · kind B2 · utility

3Cited by
6References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 29, 2006
Grant dateApr 5, 2011
Priority date
Expiry dateJul 24, 2027

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24355
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A micromechanical component has a substrate, a first intermediate layer which is situated thereupon, and a first layer which is situated thereupon and is structured down to the first intermediate layer. A second intermediate layer is situated above the first layer. A second layer is situated on the former, at least one movable micromechanical structure being structured into the second layer. The second intermediate layer is removed in a sacrificial zone beneath the movable micromechanical structure and the first intermediate layer is partially removed in zones beneath the first layer. The movable micromechanical structure is provided with at least one stop surface on a bottom face, this stop surface being contactable with a zone of the first layer which is supported by the first intermediate layer by deflection of the movable micromechanical structure. A method for producing such a micromechanical component is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.