Post-CMP cleaning compositions and methods of using same

US7919446B1 · kind B1 · utility

Assignee

• INTERMOLECULAR, INC. · US

Inventors

• Zachary Fresco · Redwood City, US
• Anh Duong · Fremont, US
• Chi-I Lang · Cupertino, US
• Nikhil Kalyankar · Hayward, US
• Nicole Rutherford · Saratoga, US
• Alexander Gorer · Los Gatos, US

Key dates

• Filing date: Dec 26, 2008
• Grant date: Apr 5, 2011
• Expiry date: Jun 29, 2029

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Compositions comprise a purine compound; an alcohol amine; a quaternary ammonium salt; an amino acid, and optionally an antioxidant. The compositions are useful in post-CMP cleaning processes. One particular advantage of these compositions is that they can effectively remove slurry contamination without increasing the roughness of the copper surface.