Structure and method for sealing cavity of micro-electro-mechanical device
US7919842B2 · kind B2 · utility
2Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2009 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Sep 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cavity package (100) for micrometer-scale MEMS devices surrounding the cavity (210) with the MEMS device (220) with a rim (232) of solder-wettable metal, and then covering the cavity with a roof (240) of solder spanning from rim to rim. A solder body, placed over the cavity to rest on the rim, is reflowed; the surface tension of the liquid solder is reduced by the interfacial tension of the rim metal so that the liquid solder spreads over the rim surface and thereby stretches the liquid ball to a plate-like roof over the cavity. After solidifying the solder, the solder-to-metal seal renders the cavity package hermetic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.