Imager die package and methods of packaging an imager die on a temporary carrier
US7923298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2007 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Feb 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication substrate comprising a plurality of imager die. Thereafter, known good die (KGD) qualified from the imager die are repopulated, face down on a high temperature-compatible temporary carrier, the KGD on the temporary carrier are encapsulated and thereafter removed as a reconstructed wafer from the temporary carrier. Furthermore, a first plurality of discrete conductive elements on a back side of the reconstructed wafer may be partially exposed and, optionally, a second plurality of discrete conductive elements may be applied to the first plurality of discrete conductive elements. The encapsulated KGD are then singulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.