Patent · US Active

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

US7927917B2 · kind B2 · utility

10Cited by

7References

20Claims

0Family size

Assignee

STATS ChipPAC, Ltd. · SG

Inventors

Reza A. Pagaila · Singapore, SG
Byung Tai Do · Singapore, SG
Jong-Woo Ha · Seoul, KR

Key dates

Filing date	Jun 19, 2009
Grant date	Apr 19, 2011
Priority date	—
Expiry date	Oct 14, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.