Dice rearrangement package structure using layout process to form a compliant configuration
US7927922B2 · kind B2 · utility
19Cited by
27References
36Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 14, 2008 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | May 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of metal traces is electrically connected to the each pads; a protection layer is provided to cover the active surface and the other ends of the exposed metal traces is electrically connected to the plurality of conductive elements, the characteristic in that the package body is a B-stage material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.