Methods and materials useful for chip stacking, chip and wafer bonding

US7932161B2 · kind B2 · utility

Assignee

• PROMERUS, LLC · US

Inventors

• Chris Apanius · Moreland Hills, US
• Robert A. Shick · Strongsville, US
• Hendra Ng · Brecksville, US
• Andrew Bell · Lakewood, US
• Wei Zhang · Brecksville, US
• Phil Neal · Wakeman, US

Key dates

• Filing date: Mar 21, 2007
• Grant date: Apr 26, 2011
• Expiry date: Oct 14, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19042
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.