Chris Apanius
3Patents
2h-index
5Co-inventors
33Inventor score
Filing activity: Mar 21, 2007 → Jan 18, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7932161B2 | Methods and materials useful for chip stacking, chip and wafer bonding | Electricity | 10 | Active |
| US8120168B2 | Methods and materials useful for chip stacking, chip and wafer bonding | Electricity | 3 | Active |
| US8816485B2 | Methods and materials useful for chip stacking, chip and wafer bonding | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.