Method of selectively removing conductive material
US7935242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2006 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Nov 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.