Method of forming a semiconductor package and structure therefor
US7935575B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2008 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Aug 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.