Method of uniform phosphor chip coating and LED package fabricated using method
US7943952B2 · kind B2 · utility
52Cited by
62References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2007 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Dec 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
Abstract
Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.