Integrated circuit arrangement including a protective structure

US7943960B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Joachim Weyers · Grevesmühlen, DE
• Peter Nelle · Munich, DE

Key dates

• Filing date: Feb 1, 2008
• Grant date: May 17, 2011
• Expiry date: Feb 10, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/038
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit arrangement. In one embodiment, the arrangement includes at least one first semiconductor zone of a first conduction type which is doped more highly than the basic doping of a first semiconductor layer and which is arranged at a distance from a first component zone adjoining the first semiconductor layer. At least one connecting zone extends as far as the at least one first semiconductor zone proceeding from the first side. A second semiconductor zone of the second conduction type, is arranged in the first semiconductor layer and is electrically conductively connected to the at least one connecting zone.