Semiconductor chip assembly with post/base heat spreader and vertical signal routing
US7948076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2009 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Jan 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally and supports the substrate. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.