Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement

US7948077B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Paul S. Andry · Yorktown Heights, US
• Evan G. Colgan · Chestnut Ridge, US
• Lawrence S. Mok · Brewster, US
• Chirag S. Patel · Peekskill, US
• David E. Seeger · Congers, US

Key dates

• Filing date: Jun 6, 2008
• Grant date: May 24, 2011
• Expiry date: Oct 21, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.