Heating configuration for use in thermal processing chambers
US7949237B2 · kind B2 · utility
11Cited by
150References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2007 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Dec 9, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B31/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.