Surface inspection apparatus and method thereof
US7952085B2 · kind B2 · utility
5Cited by
10References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 22, 2008 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Aug 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8854
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.