System including semiconductor components having through interconnects and back side redistribution conductors
US7952170B2 · kind B2 · utility
5Cited by
46References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2010 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Jul 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system includes a supporting substrate and at least one semiconductor substrate. The semiconductor component includes a semiconductor substrate having a circuit side with integrated circuits and substrate contacts and a back side, a plurality of through interconnects in the substrate, and redistribution conductors on the back side of the substrate. Each through interconnect includes a via aligned with a substrate contact, and a conductive layer at least partially lining the via in physical and electrical contact with the substrate contact. Each redistribution conductor is formed by a portion of the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.