Die stacking with an annular via having a recessed socket
US7952171B2 · kind B2 · utility
8Cited by
15References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2010 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Oct 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.