Dave Pratt
19Patents
4h-index
25Co-inventors
60Inventor score
Filing activity: Jun 12, 2001 → Sep 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6718371B1 | XML-based integrated services framework | Electricity | 41 | Expired |
| US9136259B2 | Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking | Emerging Cross-Sectional Technologies | 17 | Active |
| US7821107B2 | Die stacking with an annular via having a recessed socket | Electricity | 15 | Active |
| US7952171B2 | Die stacking with an annular via having a recessed socket | Electricity | 8 | Active |
| US9828069B2 | Mooring system | Emerging Cross-Sectional Technologies | 3 | Active |
| US8546919B2 | Die stacking with an annular via having a recessed socket | Electricity | 3 | Active |
| US8531046B2 | Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside | Emerging Cross-Sectional Technologies | 1 | Active |
| US8227343B2 | Die stacking with an annular via having a recessed socket | Electricity | 1 | Active |
| US11328749B2 | Conductive interconnects and methods of forming conductive interconnects | Electricity | 1 | Active |
| US9685375B2 | Methods of forming through substrate interconnects | Electricity | 0 | Active |
| US12014983B2 | Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one another | Electricity | 0 | Active |
| US8629060B2 | Methods of forming through substrate interconnects | Electricity | 0 | Active |
| US11482492B2 | Assemblies having conductive interconnects which are laterally and vertically offset relative to one another | Electricity | 0 | Active |
| US11545391B2 | Conductive interconnects and methods of forming conductive interconnects | Electricity | 0 | Active |
| US8034702B2 | Methods of forming through substrate interconnects | Electricity | 0 | Active |
| US7955946B2 | Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices | Emerging Cross-Sectional Technologies | 0 | Active |
| US10685882B2 | Methods of forming through substrate interconnects | Electricity | 0 | Active |
| US8927410B2 | Methods of forming through substrate interconnects | Electricity | 0 | Active |
| US11978527B2 | Conductive interconnects and methods of forming conductive interconnects | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.