Semiconductor package having through holes for molding back side of package
US7952179B2 · kind B2 · utility
2Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2007 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Jul 12, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.