BGA package with leads on chip
US7952198B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | May 14, 2008 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | May 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA package primarily includes a leadless leadframe with a plurality of leads, a chip disposed on the leads, a die-attaching layer adhering to an active surface of the chip and the top surfaces of the leads, a plurality of bonding wires electrically connecting the chip to the leads, an encapsulant, and a plurality of solder balls. Each lead has a bottom surface including a wire-bonding area and a ball-placement area, moreover, a plurality of lips project from the bottom surfaces of the leads around the ball-placement areas. The encapsulant encapsulates the chip, the bonding wires, the die-attaching layer, and the top surfaces, the bottom surfaces except the ball-placement areas. The solder balls are disposed on the ball-placement areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.