Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
US7952206B2 · kind B2 · utility
14Cited by
30References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2006 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Jul 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.