Low temperature bonding material comprising metal particles and bonding method
US7955411B2 · kind B2 · utility
8Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jan 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/8305
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.