Yusuke Yasuda
11Patents
2h-index
6Co-inventors
43Inventor score
Filing activity: Dec 27, 2007 → Oct 9, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7955411B2 | Low temperature bonding material comprising metal particles and bonding method | Emerging Cross-Sectional Technologies | 8 | Active |
| US8400777B2 | Electronic member, electronic part and manufacturing method therefor | Emerging Cross-Sectional Technologies | 3 | Active |
| US8513534B2 | Semiconductor device and bonding material | Electricity | 2 | Active |
| US8592996B2 | Semiconductor device and method of manufacturing the same | Electricity | 2 | Active |
| US8821768B2 | Bonding method and bonding material using metal particle | Electricity | 2 | Active |
| US8821676B2 | Low temperature bonding material comprising coated metal nanoparticles, and bonding method | Emerging Cross-Sectional Technologies | 2 | Active |
| US10075123B2 | Semiconductor device, motor control system, and control method for semiconductor device | Electricity | 1 | Active |
| US11159073B2 | Motor including sealing structure | Electricity | 1 | Active |
| US8008772B2 | Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof | Electricity | 1 | Active |
| US10819266B2 | Motor driving system and motor driving method | Emerging Cross-Sectional Technologies | 0 | Active |
| US10128721B2 | Motor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.