Eiichi Ide
41Patents
9h-index
57Co-inventors
78Inventor score
Filing activity: Jun 4, 1997 → Jan 22, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6507406B1 | Three-dimensional data input apparatus | Physics | 90 | Expired |
| US6268918A | Three-dimensional input device | Electricity | 61 | Expired |
| US8952525B2 | Semiconductor module and method for manufacturing semiconductor module | Electricity | 19 | Active |
| US6587185B1 | Distance measuring apparatus | Electricity | 18 | Expired |
| US6233049A | Three-dimensional measurement apparatus | Physics | 17 | Expired |
| US6049385A | Three dimensional measurement system and pickup apparatus | Physics | 15 | Expired |
| US6556307B1 | Method and apparatus for inputting three-dimensional data | Physics | 14 | Expired |
| US9439332B2 | Power module | Emerging Cross-Sectional Technologies | 14 | Active |
| US6172755A | Three dimensional measurement system and pickup apparatus | Physics | 11 | Expired |
| US7955411B2 | Low temperature bonding material comprising metal particles and bonding method | Emerging Cross-Sectional Technologies | 8 | Active |
| US6812969B2 | Digital camera | Electricity | 7 | Expired |
| US6975361B2 | Imaging system, two-dimensional photographing device and three-dimensional measuring device | Physics | 5 | Expired |
| US6882435B2 | Three-dimensional data input apparatus | Physics | 4 | Expired |
| US8840811B2 | Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same | Electricity | 4 | Active |
| US6411918B1 | Method and apparatus for inputting three-dimensional data | Physics | 3 | Expired |
| US7027641B2 | Three-dimensional shape measuring system | Physics | 3 | Expired |
| US8400777B2 | Electronic member, electronic part and manufacturing method therefor | Emerging Cross-Sectional Technologies | 3 | Active |
| US10080313B2 | Power module and method for manufacturing the same | Electricity | 2 | Active |
| US10818573B2 | Power semiconductor module with heat dissipation plate | Electricity | 2 | Active |
| US8592996B2 | Semiconductor device and method of manufacturing the same | Electricity | 2 | Active |
| US10064310B2 | Power-module device, power conversion device, and method for manufacturing power-module device | Electricity | 2 | Active |
| US8821676B2 | Low temperature bonding material comprising coated metal nanoparticles, and bonding method | Emerging Cross-Sectional Technologies | 2 | Active |
| US8821768B2 | Bonding method and bonding material using metal particle | Electricity | 2 | Active |
| US8513534B2 | Semiconductor device and bonding material | Electricity | 2 | Active |
| US9591789B2 | Power semiconductor module and power module | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.