Semiconductor package with passive device integration
US7960816B2 · kind B2 · utility
10Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2005 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Dec 23, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.