Conformal shield on punch QFN semiconductor package
US7960818B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | May 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with the present invention, there is provided a punch quad flat no leads (QFN) semiconductor package including a leadframe wherein the leads of the leadframe are selectively half-etched so that only one or more prescribed leads may be electrically connected to a conformal shield applied to the package body of the semiconductor package. The conformal shield may be electrically connected to the exposed lead(s) alone, or in combination with one or more tie bars of the leadframe. In one embodiment, outer end portions of the top surfaces of the leads of the semiconductor package are alternately exposed and non-exposed, with the non-exposed leads including a top side half-etch which causes the same to be effectively covered by the package body of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.