Thermal via heat spreader package and method
US7960827B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2009 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Jun 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.