Cleaning of plasma chamber walls using noble gas cleaning step
US7964039B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Sep 5, 2008 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Jul 21, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B7/0057
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved reaction chamber cleaning process is provided for removing water residues that makes use of noble-gas plasma reactions. The method is easy applicable and may be combined with standard cleaning procedure. A noble-gas plasma (e.g. He) that emits high energy EUV photons (E>20 eV) which is able to destruct water molecules to form electronically excited oxygen atoms is used to remove the adsorbed water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.