Multi-port pumping system for substrate processing chambers
US7964040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2008 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Feb 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87571
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An exhaust foreline for purging fluids from a semiconductor fabrication chamber is described. The foreline may include a first, second and third ports independently coupled to the chamber. A semiconductor fabrication system is also described that includes a substrate chamber that has a first, second and third interface port. The system may also include a multi-port foreline that has a first, second and third port, where the first foreline port is coupled to the first interface port, the second foreline port is coupled to the second interface port, and the third foreline port is coupled to the third interface port. The system may further include an exhaust vacuum coupled to the multi-port foreline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.