Patent · US Active

Integrated connection arrangements

US7964494B2 · kind B2 · utility

2Cited by

8References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Drexl · Mering, DE
Thomas Goebel · Wolfsberg, AT
Johann Helneder · Landsham, DE
Martina Hommel · Munich, DE
Wolfgang Klein · Zorneding, DE
Heinrich Körner · Bogen, DE
Andrea Mitchell · Munich, DE
Markus Schwerd · Holzkirchen, DE
Martin Seck · Birkenfeld, DE

Key dates

Filing date	Sep 18, 2009
Grant date	Jun 21, 2011
Priority date	—
Expiry date	Sep 18, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A connection arrangement having an outer conductive structure arranged at least partly or completely in a cutout of an electrical insulation layer is provided. An inner conductive structure is arranged at the bottom of the cutout on one side of the insulation layer. The inner conductive structure adjoins the outer conductive structure in a contact zone. A contact area is arranged at the outer conductive structure on the other side of the cutout. The contact zone and the contact area do not overlap. The bottom of the cutout is arranged to overlaps at least half of the contact area, to provide a step in the insulation layer at the edge of the cutout outside a main current path between the contact area and the inner conductive structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.