Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly

US7964542B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Krishna G. Sachdev · Wappingers Falls, US
• Mark S. Chace · Beacon, US
• Normand Cote · Bedford, US
• David L. Gardell · Saint Albans, US
• Jeffrey D. Gelorme · Plainville, US
• Sushumna Iruvanti · Wappingers Falls, US
• G. John Lawson · Barre, US
• Tuknekah M. Noble · Hanover, US

Key dates

• Filing date: Jan 12, 2006
• Grant date: Jun 21, 2011
• Expiry date: Nov 26, 2028

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C10N2040/16
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.