Integrated circuit package on package system
US7968373B2 · kind B2 · utility
4Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2008 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Aug 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package on package system including: forming a first substrate assembly; forming a second substrate, having an auxiliary access port, supported by the first substrate assembly; exposing an integrated circuit die through the auxiliary access port; and coupling an external integrated circuit on the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.