Method of interconnecting workpieces
US7971347B2 · kind B2 · utility
6Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2008 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Aug 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4919
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.