Wafer scale heat slug system
US7975377B2 · kind B2 · utility
4Cited by
7References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 17, 2006 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Oct 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer scale heat slug system is presented providing dicing an integrated circuit from a semiconductor wafer, forming a heat slug blank equivalent in size to the semiconductor wafer, dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit, attaching the integrated circuit to a substrate, attaching the heat slug to the integrated circuit and encapsulating the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.